Copper pyrophosphate

Copper pyrophosphate (CAS 10102-90-6, EC 233-279-4), also known as cupric pyrophosphate or copper(II) pyrophosphate, is an inorganic copper salt formed from pyrophosphoric acid. It carries no assigned E-code and is supplied as a light blue granular or powdered solid under various trade designations including Cupric Pyrophosphate Dihydrate and Cupric Pyrophosphate Trihydrate.

In electroplating for the electronics industry, copper pyrophosphate serves as the copper ion source in alkaline plating baths, depositing uniform, ductile copper layers onto printed circuit boards and connectors. In textile and leather processing, it acts as a surface-modifying agent, facilitating controlled metal fixation onto fibres and hides to achieve functional or decorative finishes.

Copper pyrophosphate is available in technical and electroplating grades, supplied in powder and granule form. It falls under REACH registration requirements for EU supply. Packaging is typically offered in multi-layer paper sacks or fibre drums; buyers should confirm grade specifications and compliance documentation directly with the supplier.