Ethoxylated bisphenol A dimethacrylate

Ethoxylated bisphenol A dimethacrylate (CAS 41637-38-1) is a bifunctional methacrylate monomer used as a reactive diluent and crosslinker in UV- and peroxide-curable polymer systems.

The ethoxylated backbone reduces viscosity compared to standard bisphenol A dimethacrylate, improving processability without sacrificing crosslink density in the cured network.

In UV-curable coatings and inks, it contributes to hard, chemically resistant films with controlled flexibility. This balance makes it suitable for wood, metal, and plastic substrates.

Dental and industrial adhesive formulators use it as a base monomer where toughness and dimensional stability under cure are required for high-performance applications.

In photopolymer printing plates and packaging laminates, it supports fast cure response and strong substrate adhesion under high-throughput conditions for industrial manufacturing.

Composite and structural adhesive manufacturers incorporate it to tune crosslink density and mechanical performance in fiber-reinforced systems and specialized engineering components.

Supplied as a clear to pale yellow viscous liquid, standard commercial grades are available at varying ethoxylation levels, typically EO2 to EO10, which affect final properties.

These levels directly affect viscosity, flexibility, and hydrophilicity. Buyers should confirm ethoxylation degree and methacrylate equivalent weight against specific formulation requirements.