Dimethylamine borane

Dimethylamine borane (CAS 74-94-2), commonly abbreviated as DMAB, is a stable borane complex used industrially as a selective reducing agent and electroless plating initiator. Its controlled reactivity makes it a preferred alternative to sodium borohydride in processes requiring milder, more manageable reduction conditions for industrial chemical synthesis.

In electroless nickel and cobalt plating, DMAB functions as the reducing agent that drives metal deposition onto non-conductive substrates, including plastics and printed circuit boards. The electronics industry relies on it for metallization steps where precise deposit quality and bath stability are critical procurement considerations for high-end manufacturing.

Pharmaceutical and fine chemical manufacturers use DMAB for reductive amination and selective carbonyl reduction where sodium borohydride would be too aggressive for the solvent system. It also appears in specialty polymer and adhesive formulations as a curing initiator. DMAB is supplied as a white crystalline solid, typically in powder or granule form.

Material is packaged under inert conditions to preserve stability during storage and transit. Technical grade is the standard commercial offering for most industrial applications. High-purity grades are available for pharmaceutical synthesis and electronics. Bulk quantities are available in multi-kilogram drums for laboratory and development-scale procurement.