Copper pyrophosphate

Copper pyrophosphate (CAS 10102-90-6) is an inorganic copper salt used primarily as an electrolytic bath component in industrial metal finishing and electroplating operations.

Where is Copper pyrophosphate used?

• Metal finishing and electroplating: deposits uniform, adherent copper layers across complex geometries
• Printed circuit board manufacturing: electrolytes enable through-hole plating and fine-line circuitry deposition where dimensional accuracy and conductivity are critical
• Textile and paper: surface modification agent imparting antimicrobial or conductive properties to fiber substrates and coated materials
• Leather finishing: treatments achieve controlled surface chemistry and improved dye uptake
• Packaging and printing: enhances ink adhesion or substrate wettability
• It provides a high-performance alternative to cyanide-based copper plating systems without the associated toxicity concerns.

Good to know: Not to be confused with cyanide-based copper plating systems, which carry toxicity concerns. Buyers sourcing for electronics or precision plating should confirm bath-grade specifications, including trace metal impurity limits, with the supplier.

Commercial specifications

• Technical grade, purity typically 97% to 99% for industrial use