Bisphenol a epoxy resin

Bisphenol A epoxy resin (CAS 25068-38-6) is a thermosetting polymer formed by reacting bisphenol A with epichlorohydrin. Also designated E828 in food contact applications.

Where is Bisphenol a epoxy resin used?

• Structural, protective and electronic applications: reactive matrix resin and adhesive binder
• Protective coatings: corrosion-resistant systems for industrial infrastructure, marine vessels and concrete flooring
• Structural adhesives: bonding metals, composites and substrates in automotive assemblies and aerospace components
• Electronics: encapsulating components and manufacturing printed circuit board laminates
• Building and construction: grout systems, anchoring mortars and waterproofing membranes
• It cures with a range of hardeners to form chemically resistant, high-strength materials.
• Used as the resin component in solvent-free epoxy coating systems.

Good to know: Joint integrity under mechanical stress is critical in high-performance environments; dimensional stability and electrical insulation after cure are procurement priorities. Chemical and moisture resistance determine product performance in demanding infrastructure projects.

Formulation notes

• In solvent-free epoxy coatings, the intrinsic viscosity of the resin becomes more important when less solvent is used to control application viscosity.
• Epoxy equivalent weight (EEW) affects the stoichiometric calculation of the formulation when matching resin with curing agent.
• Viscosity affects mixing, pumping, filler dispersion, degassing, coating application, adhesive processing, and casting and molding.
• Bisphenol A epoxy resins are suitable for general-purpose and high-strength formulations, while bisphenol F systems are preferred when lower viscosity or higher chemical resistance is required.

Typical specification

• Standard liquid grade has an epoxy equivalent weight (EEW) of 185–192 g/eq.
• DYD-127 grade has an epoxy equivalent weight (EEW) of 180–190.
• DYD-127 grade has a viscosity of 8,000–11,000 mPa·s.
• Liquid grades include DYD-127 and DYD-128.

Storage, packaging and handling

• Stored in original well-closed packaging in a dry and cool place.

Frequently asked questions about Bisphenol a epoxy resin

Which curing agents can be used with bisphenol A epoxy resin for room-temperature curing coating systems?

Polyamidoamides, phenalkamines, and amine adducts can be used to formulate room-temperature curing coating systems.

Technical content is compiled and updated by the SoleChem product team from public technical sources; the certificate of analysis (COA) governs product-specific specifications.